Yotsanan Partners with Netherlands and NXP for Siam Silica
Deputy PM Yotsanan Wongsuwan and Dutch officials witnessed the MOU signing for the Siam Silica project on October 14, 2026.
Stock photo for illustration only, not from the actual event
- Yotsanan partnered with the Netherlands and NXP to sign an MOU for Siam Silica on October 14, 2026.
- Mahanakorn University of Technology signed an MOA with the University of Twente for chip technology transfer.
- The Thai government offers BOI investment privileges to position Thailand as an ASEAN semiconductor hub.
- The Netherlands noted Thailand's vision aligns with Brainport to tackle global talent shortages.
On October 14, 2026, Mr. Yotsanan Wongsuwan, Deputy Prime Minister and Minister of Higher Education, Science, Research and Innovation (MHESI), alongside Mr. Geoffrey van Leeuwen, Minister for Foreign Trade and Development Cooperation of the Netherlands, served as chairs and witnesses for the Memorandum of Understanding (MOU) signing between NXP Manufacturing (Thailand) Co., Ltd. and the Siam Silica project.
In addition to the corporate MOU, a Memorandum of Agreement (MOA) was signed between Mahanakorn University of Technology and the University of Twente from the Netherlands. The ceremony was attended by distinguished figures including Ms. Margriet Leemhuis, Ambassador-designate, Mr. Jerome Chu, Dr. Sriyada Palimaphan, Advisor to the Minister of MHESI, Mr. Chatrin Janhom, Secretary to the Minister, Dr. Panphet Arunyee, Deputy Permanent Secretary, Mr. Sayan Suanya, Prof. Freek van der Meer, and Asst. Prof. Dr. Phanom Petchjatuporn at NXP Manufacturing (Thailand) Co., Ltd.
Mr. Yotsanan highlighted the strategic significance of this collaboration, noting that Thailand possesses a robust manufacturing base in electric vehicles (EVs) and electronics. Producing chips or related components domestically will significantly reduce logistics costs and propel Thailand to become a regional logistics center. Consequently, MHESI has engaged with NXP to encourage the expansion of research and development (R&D) and production capacity in Thailand, with the government ready to support and consider privileges via the Board of Investment (BOI).
Stock photo for illustration only, not from the actual event
The semiconductor partnership between Thailand and the Netherlands through the Siam Silica initiative and the University of Twente marks a critical turning point in upgrading Thailand's technology supply chain. Given that the Netherlands hosts global lithography equipment leaders like ASML, integrating Dutch expertise and advanced nano labs will help bridge the high-skill talent gap essential for the high-value semiconductor industry.
The Deputy Prime Minister further noted that his previous visit to the University of Twente—a leading institution in IC semiconductor design—inspired the proposal for an "ASEAN Chips Act" at regional meetings. This act aims to establish protocols and share semiconductor supply chains across Southeast Asian nations, with Thailand acting as a central connector to apply intellectual property to energy, communications, and photonic chip industries.
Mr. Geoffrey van Leeuwen expressed great pleasure on behalf of the Netherlands in witnessing the signing ceremony. He pointed out that the primary challenge facing the Dutch semiconductor sector is not energy costs or infrastructure, but a critical shortage of specialized talent. Thailand's Siam Silica project shares a strong vision with the Dutch Brainport initiative, as talent development should transcend borders to ensure stable global growth.
This comprehensive cooperation stems from Mr. Yotsanan's European tour last June, which included in-depth discussions with the University of Twente and leading technology institutes in the Netherlands and Belgium to prepare local human resources for Thailand's emergence as a premier semiconductor hub.
Source: Khaosod Politics
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